By Duixian Liu; et al
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Additional resources for Advanced millimeter-wave technologies : antennas, packaging and circuits
G. 20 or more. Individual substrates are clamped into the package, which simplifies the assembly and disassembly process. The local substrate ground is contacted to the overall package ground via the substrates’ gold-plated backside metalization. 12: CNC-milled mmWave package used in R&S network analyzers for frequencies up to 24 GHz. Reproduced by permission of © 2008 Rohde & Schwarz. electrically ‘stealthy’ clickable plastic bars, apply pressure to the substrate where needed, for instance, at the transfer points of a microstrip line.
1 Low Cost Why do we need low-cost packaging technologies in the first place and how low does the cost really have to be? The answer is highly dependent on the required complexity, performance, market volumes and business plans. Depending on whom one is talking to, the answer may be that the packaging cost has to be low enough to open up emerging markets and to maximize profit margins. The real cost challenge arises, however, if the package cost cannot follow the die cost reduction. 7 illustrates the general cost versus volume trade-off that is typically assumed for silicon chips.
Chapter 9 moves the discussion forward into the very new area of metamaterials for mmWave antenna applications. Simply defined, metamaterials are artificial materials with engineered properties not readily available in nature. In particular, metamaterials with simultaneous negative permittivity and negative permeability, known as left-handed (LH) metamaterials, will be shown to have good application to antenna designs, because of their unique characteristics of negative refractive index, fundamental backward wave, and infinite wave with non-zero group velocity.